Overview
Vice President of Engineering (Mixed-Signal ICs) – Location: Germany, North Rhine-Westphalia
About the Role
We are seeking an experienced and visionary Vice President of Engineering to lead and scale our integrated circuit design and development teams. This senior executive role is ideal for a technically sharp, strategically minded leader with a strong background in digital, analog, and mixed-signal IC design, and a proven track record of taking silicon products from architecture through to mass production. Working in close partnership with the CTO, you will shape our engineering roadmap, guide technical decision-making, and drive innovation across next-generation products for communications and sensing applications.
Responsibilities
* Define and own the engineering strategy and execution roadmap for our mixed-signal products
* Lead multidisciplinary teams across analog, digital, and mixed-signal domains (architecture, design, layout, verification)
* Oversee the full product development lifecycle, from design and validation to tape-out, test, and production
* Balance complex trade-offs between performance, power, area, and cost
* Establish scalable processes, best practices, and engineering excellence across teams
* Collaborate closely with product management, operations, and customer teams for successful delivery
* Represent engineering with customers, partners, and stakeholders
Qualifications
* 15+ years of engineering experience in the semiconductor industry, including 5+ years in senior or executive leadership roles
* Deep expertise in both analog and digital circuit design, with strong mixed-signal IC experience
* Proven success leading teams through multiple silicon tape-outs and high-volume production cycles
* Hands-on familiarity with industry-standard EDA tools and methodologies (Cadence, Synopsys, etc.)
* Strong understanding of system-level integration, test methodologies, and post-silicon validation
* Demonstrated ability to build, scale, and retain high-performing, geographically distributed teams
* Experience managing budgets, timelines, and engineering KPIs
* Excellent leadership, communication, and stakeholder management skills
* MSc or PhD in Electrical Engineering, Microelectronics, or a related field
What We Offer
* The chance to lead cutting-edge innovation in mixed-signal ICs for next-generation communication and sensor technologies
* A high-impact leadership role within a fast-paced, mission-driven environment
* Competitive compensation package including equity participation
* An international, inclusive team culture that values creativity, ownership, and results
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