We are Mobileye's Production Test team - responsible for the definition, development, and deployment of production test operations for the world's most advanced SoC's for ADAS and self-driving vehicles.
This is your opportunity to join a team during its initial forming stage and leave your mark as Mobileye assumes full ownership for its silicon production operations to enable high volume manufacturing for cutting-edge automotive products.
What will your job look like?
* Work closely with design and test engineers from the earliest development phases to review chip electrical and mechanical specifications and define the hardware architecture and requirements for Load Boards (LB) and Probe Cards (PC).
* Lead and oversee all aspects of LB and PC development, including schematics, BOM selection, PCB layout, PI/SI simulations, and mechanical design.
* Define, guide, and validate test‑socket requirements, specifications, design, and electrical performance.
* Establish electrical and mechanical specifications for custom RF modules integrated into the complete test system architecture.
* Manage supplier interactions and logistics, ensuring accurate tracking of manufacturing status, delivery schedules, quality assurance, and repair/RMA processes.
* Own hardware‑readiness activities, including validation, qualification, and release of test hardware into engineering and production environments.
* Support post‑silicon test‑program debug efforts, resolving hardware‑related issues and enabling timely delivery of samples to internal and external customers.
All you need is:
* B.Sc. in Electrical Engineering.
* 7+ years of experience in hardware board design and development, including 3+ years in a technical leadership role.
* Strong foundation in Signal Integrity (SI) and Power Integrity (PI) analysis, modeling, and debug.
* Hands‑on experience with PCB design tools and reviewing complex, high‑speed, multilayer layouts.
* Practical experience with RF simulation tools such as HFSS or equivalent EM solvers.
* Experience supporting manufacturing and test processes, including close collaboration with external suppliers.
* Prior experience with Load Board or Probe Card design — a significant advantage.
* Excellent communication, documentation, and cross‑team collaboration skills.
* Strong teamwork skills and adaptability in fast‑paced, rapidly evolving environments.
* Strong interpersonal and relationship‑building capabilities.