ZEISS Semiconductor Manufacturing Technology – Enabling smaller, more powerful and more energy-efficient microchips
Working where tomorrow is created.
Around 80 percent of all microchips worldwide are manufactured using ZEISS technologies. As the heart of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is the technology leader in semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and solutions for process control, ZEISS enables the manufacture of ever smaller, more powerful and more energy-efficient microchips – and is thus playing a decisive role in shaping the age of micro- and nanoelectronics with its innovations.
Your Role
1. You develop and program advanced PLC control systems for high-end wafer processing tools within a demanding Fab environment
2. You perform seamless hardware and software integration of advanced sensors, high-performance actuators (e.g., mass flow controllers, robotic arms), and fieldbus systems
3. You bridge the gap between the tool and the factory level by implementing SECS/GEM or OPC UA interfaces for MES/ERP connectivity
4. You develop and optimize SCADA systems for real-time equipment monitoring, alarm
management, and data visualization to ensure maximum tool uptime
5. You configure and troubleshoot industrial protocols such as EtherCAT, PROFINET, or
EtherNet/IP for low-latency machine internal communication
6. You executeon-site commissioning, tool installations, and final acceptance tests (FAT/SAT) at international customer Fabs
7. You troubleshoot and resolve complex automation and connectivity issues to maximize tool uptime and yield
Your Profile
8. Educational Background: Degree in Engineering (Automation, Electrical, Computer Science) or State-certified Technician with a focus on industrial automation and many years of professional experience
9. Automation & SCADA Expertise: Proven track record in PLC programming (e.g., TwinCAT 3, TIA Portal) and HMI/SCADA design for complex, high-end machinery
10. Electronics & E-Plan: Solid understanding of electronics and electrical engineering; ability to read and interpret E-Plan schematics is a plus
11. System Integration: Deep experience in hardware/software integration of sensors, actuators, and connectivity protocols (SECS/GEM, OPC UA)
12. Soft Skills: A high degree of organizational skills, teamwork skills, agility, flexibility and an independent, structured and proactive approach to work
13. Mobility: Willingness to travel internationally (approx. 20-40%) for tool commissioning and technical alignments
14. Language: Fluency in English is required; German skills are advantageous
Your ZEISS Recruiting Team:
Oliver Reith