Principal Engineer Package Concept Engineering (f/m/div)
Do you want to build the bridge between AI computing product requirements and package solutions? Do you want to shape semiconductor packages from concept to implementation? If this sound like a perfect challenge to you, apply as Principal Engineer for Package Concept Engineering and you will work on best-in class package solutions that enable future AI computing trends. Bring in your technical expertise into our team, translate input from Infineon product experts, align with BE development colleagues and develop the right package – exploring technical limits and possibilities. With this position you will be entering our „technical ladder”: our career path for experts. You will be able to focus deeply on technology – while further pursuing your career. As you continually expand your expert knowledge, puzzle over matters and solve problems, you will position yourself as a thought leader – thus helping our products improve our world a bit more each day.
In your new role you will:
* Define package concepts for DCDC power supply products with focus on high-performance computing modules
* Validate package concepts through simulation and hardware demonstrators in cooperation with BE development, product development and system architects
* Align new ideas and concepts with BE development (in-house + OSAT) and initiate assembly projects
* Follow up and support package development projects until final release of the product
* Identify new development topics and incorporate them into the package roadmap
* Support our customers with package specific questions
* Stay up to date on package solutions through continuous market screening and competitor analysis
* Identify business opportunities enabled by new technologies and concepts
You have a clear idea of how innovation contributes to business success. To achieve your ambitious goals, you cooperate across borders, recognize the contribution of others and use the resulting creative potential. Furthermore, you remain solution-oriented, open and flexible even when under pressure.
You are best equipped for those tasks if you have:
* A technical background through a degree in e.g. Physics or Electronics
* At least 6 years practical experience in assembly technologies with detailed knowledge of BE processes and materials and their dependencies laminate design, materials, processes ideally with background knowledge of SMT related technologies
* Experience with typical package design tools (e.g. AutoCAD/ Cadence)
* Proven ability to solve problems with higher complexity by pro-actively involving expert networks
* Advanced communication and presentation skills as well as a high motivation to expand your scope
* Occasional willingness to travel to customers and vendors
* Fluent in English, German is a plus
Contact:
Julie Danielsen Larsen, LinkedIn
#WeAreIn for driving decarbonization and digitalization.
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