About us We see the semiconductor industry as a realm of possibility. We see opportunities. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects About our technology The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution The Role Black Semiconductor is looking for a Senior Advanced Packaging Architect (f/m/d) to join our photonics product development team. In this pivotal role, you will architect the next generation of advanced packaged SOCs incorporating advanced CMOS processes and latest photonics innovation targeting data centers and edge AI use cases You will be responsible for designing and implementing advanced packaging solutions for high-performance heterogeneous, silicon and photonics, SOCs using chiplet architecture. You will be foundry and OSAT interface person for advanced packaging vendor evaluation, technology selection, feasibility study, design, manufacturing, assembly, test, and qualification To join our team, you should be excited to Fully documented SOC Advanced Packaging Product Requirement Specification (PRS) per product that includes package design, verification, thermal/mechanical analysis, quality/reliability and estimations for performance and cost Fully documented advanced packaging IP roadmap aligned with our technology capabilities and OSATs Fully documented Customer Packaging Requirement Document (CRD) per customer engagement Advanced Packaging concept and feasibility documents that describe the solution space explored and recommendation on final architecture Fully documented advanced packaging ecosystem and competitive analysis Your Qualifications Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science is required; Master’s or PhD preferred 10 years of experience in semiconductor packaging with a focus on advanced techniques such as 2.5D/3D integration, fan-out packaging, or system-on-chip (SoC) solutions 10 years of experience with 2.5D/3D/3.5D heterogeneous integration technologies such as SoIC, CoWoS, WoW, and Photonics 10 years of experience in advanced packaging and organic substrate technology, silicon, interposer, substrate manufacturing process, assembly flow, functional and reliability test, and qualification 10 years of experience with wafer bumping, package assembly, substrate technology, BOM selection, testing, and product development lifecycle 10 years of experience in understanding core and build-up material mechanical/electrical properties, trade-offs, CTE mismatch, TSV impact on warpage, stress, reliability, and Chip Package Interaction (CPI) Other Understanding of current silicon photonics packaging and connectivity Successful customers engagement on so-architecting customer specific solutions Our work culture People Over Processes. At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work-life harmony, where careers are meaningful and enriching. Our processes are human-centric, allowing you to focus on what matters Let’s grow together. Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal development Your Health and Future Matter. Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and future We Live Openness. Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength, fueling innovation and driving us forward We connect chips – and people. We encourage qualified individuals from any background to apply. We foster an inclusive and supportive work environment that values collaboration, innovation, and growth. Join our team and be part of an organization dedicated to making a difference in the industry Can you picture yourself in this Role and our Company? Let’s connect