Unlock the Potential of Integrated Photonics
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Description:
* Packaging Expert for Photonic Integrated Circuits
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We are seeking an innovative Packaging Expert to join our team and drive the development of advanced photonic packaging solutions. As a key member of our interdisciplinary team, you will play a crucial role in designing and developing high-performance and reliable photonic integrated circuits (PICs).
Your primary responsibilities will include:
* Developing and designing packaging solutions for PICs, encompassing mechanical, thermal, and optical interfaces.
* Optimizing package designs for performance, reliability, and manufacturability, taking into account thermal management, optical coupling, electrical connectivity, and mechanical stability.
* Collaborating with external suppliers and internal teams to build prototypes and transition from concept to full-scale production.
* Ensuring design-for-manufacturability principles are applied to the photonic packages to ensure scalability and cost-effectiveness.
* Conducting thermal and stress evaluations of photonic packages to guarantee adequate heat dissipation and mechanical integrity under diverse environmental conditions.
* Designing package structures that optimize optical alignment between the PICs, optical fibers, optical components, and external devices such as lasers and detectors.
* Establishing high-precision alignment and assembly processes, outlining test protocols to assess the performance and reliability of the packaging solutions, and interpreting test data to drive further improvements.
* Closely collaborating with photonic designers, engineers, process engineers, and manufacturing teams to enhance packaging solutions.
To succeed in this role, you will require:
* A Master's degree or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
* Specialized knowledge or coursework in photonics, optoelectronics packaging, or microsystems.
* At least 3 years of industry or academic experience in the design and development of packaging solutions, preferably for photonics, optoelectronics, or semiconductor devices.
* Experience with packaging techniques such as wire bonding, flip-chip bonding, and fiber-optic alignment is highly desirable.
* Proficiency with CAD tools for 3D modeling and simulation (e.g., SolidWorks, AutoCAD, or ANSYS).
* Experience with thermal and stress simulation tools such as COMSOL or FEA software.
* Understanding of materials used in photonics packaging, including ceramics, polymers, metals, and adhesives.
* Familiarity with cleanroom and assembly techniques for photonic and electronic components.
* Strong analytical and problem-solving skills, with attention to detail in complex systems.
* Excellent communication and collaboration abilities, with a proactive approach to teamwork in English and German.
* Ability to work in a fast-paced, deadline-driven environment.
If you are passionate about driving innovation in photonic technologies and have a strong background in packaging design and development, we encourage you to apply for this exciting opportunity.