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Job Description
* Experience research : You review literature on robustness of materials for MEMS applications
* Focus on the future: You plan experimental test series on wafer level in a production environment and a material laboratory
* Reliable work: You are responsible for sample preparation and execution of experiments, including bow, film stress, conductivity and robustness measurements
* Data is everything: You analyze and present the results obtained through experiments in your thesis and evaluate Nanoindentation data
Your Profile
* Study field : You are currently studying Microsystems Engineering, electrical engineering, material sciences, physics or similar
* Experience : Ideally, you already gained some first experience in a laboratory environment and in testing and the characterization of thin films (<1µm)
* Personality: You have strong analytical skills and problem-solving abilities
* Language skills : You have fluent German and English skills, both written and spoken
Please attach the following documents to your application:
* CV in English
* Certificate of enrollment at university
* Excerpt of the study regulations for the thesis (if applicable)
* Latest grades transcript (not older than 6 months)
* High school report
Further links:
* Find out what we are looking for in your CV
* Find out how the student application process works with us
Discover our student website
Contact:
Julia Flammersberger
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
The Frontend (FE) cluster combines the highest technology and manufacturing expertise to produce innovative and reliable products. The portfolio consists of power, bipolar, sensors, SMART-power and diode technology as well as CMOS, RF-CMOS and embedded flash technologies. The manufacturing sites in Austin, Dresden, Kulim, Regensburg and Villach are committed to "Operational Excellence" with a strong customer focus.
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