About the Job We're looking for an experienced Senior Director of Integration Engineering - NPI (f/m/d) to lead the process integration team in developing and scaling our next-generation semiconductor technology. As a key technical leader, you will drive the integration of novel materials (e.g., graphene) and photonic components into advanced semiconductor architectures. Your work will directly impact the realization of innovative products that combine high-speed optical and electronic functionality on a single chip. In this role, you’ll: Define and own the end-to-end process integration flow for advanced semiconductor devices across development and pilot production Lead cross-functional integration efforts between process engineering, device engineering, metrology, and reliability teams Oversee the integration of novel materials and photonic elements within CMOS-compatible fabrication environments Drive defect root cause analysis, yield improvement initiatives, and process window optimization Collaborate with R&D, Fab engineering, and external partners to transition technologies from proof-of-concept to volume manufacturing Develop and implement technology roadmaps, process integration strategies, and risk assessments Establish and manage metrics for performance, quality, and throughput across integration milestones Build and lead a high-performing, multidisciplinary engineering team; mentor junior staff and foster a culture of technical excellence and innovation Provide strategic input to senior leadership on manufacturing readiness, scalability, and investment planning Your Profile Master’s or PhD in Electrical Engineering, Materials Science, Applied Physics, or a related field 10 years of experience in semiconductor device/process integration, preferably in advanced node CMOS, photonics, or compound semiconductors Proven track record in process integration leadership, including the introduction of new technologies and products into manufacturing (NPI) Hands-on experience with 300mm semiconductor manufacturing, particularly in backend integration (e.g., interconnects, wafer-level packaging, TSV, bonding) Proven track record in process integration leadership, including introduction of new technologies into production Deep understanding of semiconductor fabrication, metrology, materials interfaces, and failure mechanisms Experience with yield engineering, SPC, DOE, and process simulation tools Strong leadership skills with experience in managing cross-functional and international teams Excellent communication skills in English; German is a plus Please note that we are looking for support in the Aachen office of our portfolio company. Eligibility to work within the EU is required as well. Benefits and Perks Comprehensive benefits package with outstanding insurance, pension and virtual stock options at our portfolio company An inspiring, creative and diverse environment with professional and motivated colleagues from all over the world Transparent and open culture where every person is highly valued and respected Getting challenged and developing your professional skills by taking over responsibilities, and a guaranteed steep learning curve from day one A supportive environment that prioritises work-life balance Be part of a professional network within the Project A family, with access to regular events, knowledge exchange and meetups Apply below and become a part of our success story! Our Commitment to Diversity and Inclusion Project A is committed to diverse and equal opportunities hiring for all – applicants, candidates, and employees alike. We value humans – with all our glorious multifaceted backgrounds, perspectives, and experiences – and look forward to your application.