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Technology expert in thin-film magnetic inductor

Moosach
Huawei Research Center Germany & Austria
Inserat online seit: 28 Juli
Beschreibung

Huawei's Munich Research Center is responsible for advanced technology research, architectural development, design and strategic engineering of our products. Huawei Munich Research Center (MRC) is looking for a technology expert in the topic of thin-film magnetic inductors to optimize next-generation integrated power supply. Thin film magnetic material innovation, Inductor design, MEMS-based fabrication, thermal, stress, and heterogeneous integration, are important issues in the development of high performance inductors. I hope you will join our team to explore advanced thin-film inductors. Join us as a Technology Expert In Thin-film Magnetic Inductor (m/f/d) Your mission 1. Magnetic Thin-Film Inductor Design & Simulation Develop electromagnetic models (Maxwell, HFSS, COMSOL) for tens of MHz-range inductors, optimizing for inductance, Q-factor and current density et al. Break Snoek’s limit via novel nano-laminated structures (e.g., CoFeB/SiO₂, CTZ-CZTO). 2. Magnetic Film Sputtering & Material Engineering Optimize PVD processes (DC/RF sputtering) for amorphous & nanocrystalline soft magnetic films (e.g., CoZrTa, nanogranular films). Engineer dielectric interlayers (SiO₂, Al₂O₃, CZTO) via reactive sputtering (O₂/Ar plasma) or ceramic target deposition. Characterize film properties: μ_r (permeability), ρ (resistivity), H_c (coercivity) using VSM, FMR, TEM. 3. MEMS-Based Inductor Fabrication Drive patterning processes: PI pattern design: Wings with gentler slopes and DRIE (for high-aspect-ratio vias). Develop etch recipes for magnetic alloys (e.g., Cl₂/BCl₃ IBE) with different sidewall angles. Implement planarization (CMP) and stress management for multilayer stacks (up to 10 layers). Chemical and Electroplating Copper Process 4. 3D Integration & Advanced Packaging Integrate thin-film inductors with TSV (Through-Silicon Via) and wafer-level packaging (Fan-Out, CoWoS). Solve EMI/thermal challenges in power delivery networks (e.g., magnetic shielding using metals). Your areas of expertise PhD degree or Master in magnetics, microelectronics, nanotechnologies, physics of semiconductor, or other related domains With hands-on experience no less than 5 years in this field The candidate should have a solid knowledge in the following areas: magnetic materials, electromagnetic simulation, semiconductors and innovative materials, nano-/micro-fabrication process (FEOL, BEOL), heterogeneous integration, 3DIC packaging, optoelectronic components, device thermal dissipation management, back-end test, etc. Fluency in oral and written English is a must. Speaking German or Chinese is a plus, but not necessary. The candidate needs to show keen insight and analytical ability in the areas and have strong self-learning capabilities. Business trips in Germany and other European countries are required, mainly for conferences and seminars. By applying to this position, you agree with our Recruitment Privacy Statement. You can read in full our privacy policy here. Your rewards of working here Our culture is characterized by innovative power and team spirit as well as the intensive exchange of knowledge and experience within our global network. We offer healthy meals ranging from traditional Chinese to western delicacies in our famous company canteen. To keep your development ongoing, you will find a broad range of training opportunities. Many online and face-to-face training programs incl. language courses in German and Mandarin. Our diverse and welcoming environment is shaped by different backgrounds and around 40 individual nationalities. Self-responsible work in a competent, motivated and constantly growing team. Please send your application and CV (incl. cover letter and reference letters) in English. Huawe i is a leading global information and communications technology (ICT) solutions provider. Driven by a commitment to operations, ongoing innovation, and open collaboration, we have established a competitive ICT portfolio of end-to-end solutions in Telecom and enterprise networks, Devices and Cloud technology and services. Our ICT solutions, products and services are used in more than 170 countries and regions, serving over one-third of the world's population. With 197,000 employees, Huawei is committed to develop the future information society and build a Better Connected World.

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