We are seeking an experienced and visionary Vice President of Engineering to lead and scale our IC design and development teams. This executive position is ideal for a technically sharp and strategically minded leader with a strong background in digital, analog, and mixed-signal IC design, coupled with proven success in bringing silicon products to mass production. In this role, you will work in close cooperation with the CTO to shape the engineering roadmap, drive innovation, and guide the team through all stages of development—from architecture to tape-out and product launch.
Define and own the engineering strategy and execution roadmap for our mixed-signal products.
Establish and maintain scalable engineering processes and best practices.
Collaborate closely with product management, operations, and customer teams to ensure successful delivery and deployment.
Represent engineering in front of customers, strategic partners, and executive stakeholders.
15+ years of engineering experience in the semiconductor industry, with at least 5 years in executive or senior leadership roles.
~ Hands-on familiarity with EDA tools and methodologies across the IC design flow (Cadence, Synopsys, etc.).
~ Track record of building, scaling, and retaining high-performing, geographically distributed engineering teams.
~ Experience in defining and managing budgets, timelines, and engineering metrics.
~ Excellent leadership, communication, and stakeholder management skills.
~ MSc or PhD in Electrical Engineering, Microelectronics, or a related field.