The department System Packaging focuses on innovative packaging technologies for microelectronics and power electronics. The main emphasis lies on the development of reliable interconnection and bonding techniques that meet increasing demands in thermal and mechanical stability. In the context of electromobility and other high- tech applications, we investigate new approaches for using copper as a cost-efficient and high-performance material in packaging solutions.
With the continuous advancement of power electronics, the demand for innovative packaging technologies that ensure high thermal and mechanical reliability is rapidly increasing. One of the strongest driving forces behind this trend is the electric vehicle (EV) industry, where efficient, robust, and cost-effective packaging solutions are essential for next-generation devices.
Traditionally, silver-based sintering pastes state of the art for die / substrate-attach materials. However, copper has recently emerged as a promising alternative due to its lower cost, high availability, and excellent electrical and thermal properties. Despite these advantages, copper sintering presents significant challenges. Porosity of copper pastes critically influences the thermal conductivity, electrical conductivity and the mechanical stability of the joint, making its evaluation and control a key challenge for industrial adoption.
This thesis project will focus on investigating the porosity evolution in different copper pastes after sintering and its influence on the properties of the sintered interface. The work will involve conducting sintering experiments using a sintering press with selected copper pastes, followed by detailed characterization of the resulting interfaces in terms of porosity, thermal and mechanical integrity. In parallel, simulation models will be developed to describe and predict porosity formation and evolution after the sintering process.
We are looking for a motivated and committed student to take on this exciting Master's thesis project and contribute to shaping the future of power electronics packaging.
What you will do
* Conduct a literature review on copper sintering and porosity evaluation methods.
* Select and prepare suitable copper pastes for experimental study.
* Perform sintering experiments using a sintering press under defined conditions.
* Characterize sintered samples to quantify porosity and bond properties.
* Develop simulation models to describe porosity evolution after sintering.
* Validate simulation results with experimental data.
* Correlate process parameters, porosity, and joint performance.
* Document results and compile the thesis report.
What you bring to the table
* You are enrolled in a Master’s program in Microsystems Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related fields.
* You are studying in Chemnitz, Mittweida or the surrounding area.
* You have basic knowledge of materials characterization and / or simulation tools (e.g. COMSOL).
* You are interested in experimental lab work.
* You have very good proficiency in German or English (spoken and written).
* You have an independent and structured working style.
* An average grade of
Requisition Number: 81312 Application Deadline: