Description As a High-Speed Circuit Board Design Engineer, you will play a crucial role in our Subsystems Organization, focusing on the design and development of cutting-edge optical interface modules for DWDM (dense wavelength-division multiplexing) transmission systems. Collaborating with a dynamic team of electrical, optical, and software engineers, you will tackle complex challenges in developing miniaturized optical transmitter modules used in telecommunication systems. Your work will involve concept development, optoelectronic design, and prototyping, ensuring seamless transfer to manufacturing. The work environment is innovative and collaborative, encouraging you to engage with both internal and external teams to bring new product designs to life. You'll thrive in a hands-on setting, pushing the boundaries of technology while enhancing your skills in modeling, simulation, and experimental work. Join us to contribute your expertise and passion for solving problems in a fast-paced, forward-thinking atmosphere. Responsibilities Develop leading-edge packaging platform for high-speed coherent optical transmission systems. Concept development, detailed optoelectronic design including analysis of component and processing tolerances, prototyping and transfer to manufacturing. Engage with both internal and external teams to support new product designs for manufacturing. Qualifications Master/doctoral degree in physics, electrical engineering or a related field Expertise with optical and RF (radio frequency)/microwave simulation and analysis tools Confident and comfortable in both modeling/simulation and experimental work, with hands-on attitude in supporting design verification and pilot production. Lab experience with high-frequency test setups and measurement equipment desired. Very good English skills fluent in spoken and written.