Huawei's Munich Research Center is responsible for advanced technology research, architectural development, design and strategic engineering of our products. The Precision Module and Equipment L aboratory aims at developing fundamental and core technologies needed for the advanced modules, including design, process and testing. Join us as a Glass PCB Technical Engineer (m/f/d) As a glass PCB technical expert, you will be responsible for glass PCB board-level architecture innovation and fundamental research on glass-based PCB technologies, including material applications, process integration, and related technical studies, as well as industry information insights. Your mission Lead the innovative architecture design for glass-based PCB: Addressing the unique challenges faced by Huawei's large chips in computing & networking, leveraging the unique engineering properties of Ultra Low CTE & Low Loss glass to achieve next-generation board-level architecture innovation Lead the research and technological breakthroughs in glass-based PCB innovation: Based on the innovative architecture of glass-based PCBs, study the application of advanced glass materials and high-density process integration, and solve the key engineering challenge in glass application by making the manufacturing process transparent Lead the construction of the glass-based PCB technology platform by issuing glass PCB design specifications, process control requirements, and incoming material quality standards, ensuring the competitive market launch and stable quality of glass PCBs Lead the development of technology roadmaps and technical insights for glass PCB technology, ensuring the continuous evolution of glass PCBs as innovative components in board-level architecture, while supporting sustained leadership in power consumption and computing power competitiveness for large chips in computing and networking scenarios Your areas of expertise Over 5 years of experience in advanced packaging applications on glass substrates/PCB Engaged in research on innovative architectures for glass substrate packaging, high-density miniaturization, and core technology research By applying to this position, you agree with our Recruitment Privacy Statement. You can read in full our privacy policy here. Your rewards of working here Our culture is characterized by innovative power and team spirit as well as the intensive exchange of knowledge and experience within our global network. We offer healthy meals ranging from traditional Chinese to western delicacies in our famous company canteen. To keep your development ongoing, you will find a broad range of training opportunities. Many online and face-to-face training programs incl. language courses in German and Mandarin. Our diverse and welcoming environment is shaped by different backgrounds and around 40 individual nationalities. Self-responsible work in a competent, motivated and constantly growing team. Please send your application and CV (incl. cover letter and reference letters) in English Huawe i is a leading global information and communications technology (ICT) solutions provider. Driven by a commitment to operations, ongoing innovation, and open collaboration, we have established a competitive ICT portfolio of end-to-end solutions in Telecom and enterprise networks, Devices and Cloud technology and services. Our ICT solutions, products and services are used in more than 170 countries and regions, serving over one-third of the world's population. With 197,000 employees, Huawei is committed to develop the future information society and build a Better Connected World.