Research Associate (m/f/d) RF‑Chipdesign for a sub‑THz Wireless Communication Interfaces in Chiplets Fraunhofer EMFT invites applications for the Research Associate position in RF chip design for sub‑THz wireless communication interfaces in chiplets. Overview Fraunhofer EMFT is a leading research institute in electronic microsystems and solid‑state technologies. The RF Design Group focuses on integrated circuits and systems in the mmWave and sub‑THz range, developing functional interposers and passive structures for heterogeneous chip‑let integration. The goal is to research and design wireless communication interfaces that enable robust, high‑throughput connectivity for non‑planar and mobile devices. Responsibilities Design and development of integrated RF circuits and systems in the mmWave and sub‑THz range for chip‑let wireless communication interfaces. Design of high‑speed control circuits and interfaces to embed wireless communication interfaces into complex, highly integrated systems. Design of passive RF components and 3D structures for heterogeneous integration of wireless communication interfaces on chip‑lets and functional interposers. Characterization of RF circuits and passive structures using state‑of‑the‑art RF measurement equipment. Close collaboration with internal technology departments for hetero‑integration and external partners in high‑level research projects. Support of business activities with industrial partners by providing technical expertise. Presentation of project results at international conferences and to project partners. Qualifications Completed PhD or Master’s degree in electrical engineering or communication technology with a focus on high‑frequency, RF, and analog circuit design. At least 3 years of experience in RF and analog IC design. At least 3 years of experience in Website electromagnetic field simulation of mmWave components and structures. Advanced experience with complex RF measurement equipment. Knowledge of Cadence Virtuoso, Cadence EMX Designer, ANSYS HFSS, and CST Studio Suite. High motivation and the ability to quickly learn new challenges. Enjoyment of teamwork to achieve high‑quality results. Independent and structured working style with a holistic perspective and strong problem‑solving skills. Benefits Challenging, varied work with purpose and responsibility – you tackle societal challenges and shape the future. Opportunity for creativity and innovation – you can set your own priorities and realize your ideas in the team and projects. Teamwork makes the dream possible – you work in an open, dynamic team that trusts you from day one. Integration into a large scientific network with a structured onboarding program. Individual and extensive training opportunities and career development, e.g., PhD support or participation in the Fraunhofer TALENTA Women’s Programme. Work‑life balance through flexible working hours, a child‑friendly office, hybrid working and many other offers. Good transport connections and a discounted company travel ticket. Wir wertschätzen und fördern die Vielfalt der Kompetenzen unserer Mitarbeitenden und begrüßen daher alle Bewerbungen – unabhängig von Alter, Geschlecht, Nationalität, ethnischer und sozialer Herkunft, Religion, Weltanschauung, Behinderung sowie sexueller Orientierung und Identität. Schwerbehinderte Menschen werden bei gleicher Eignung bevorzugt eingestellt. Unsere Aufgaben sind vielfältig und anpassbar – für Bewerber*innen mit Behinderung finden wir gemeinsam Lösungen, die ihre Fähigkeiten optimal fördern. Die wöchentliche Arbeitszeit beträgt 39 Stunden. Die Stelle kann auch in Teilzeit besetzt werden. Anstellung, Vergütung und Sozialleistungen basieren auf dem Tarifvertrag für den öffentlichen Dienst (TVöD). Zusätzlich kann Fraunhofer leistungs- und erfolgsabhängige variable Vergütungsbestandteile gewähren. Bereit für Veränderung? Dann bewerben Sie sich jetzt, und machen Sie einen Unterschied! Nach Eingang Ihrer Online‑Bewerbung erhalten Sie eine automatische Empfangsbestätigung. Dann melden wir uns schnellstmöglich und sagen Ihnen, wie es weitergeht. Marco DietzGroupleader RF‑Design E‑Mail: marco.dietz@emft.fraunhofer.de Fraunhofer‑Institut für Elektronische Mikrosysteme und Festkörper‑Technologien EMFT www.emft.fraunhofer.de Kennziffer: 80540 Bewerbungsfrist: 31.01.2026 #J-18808-Ljbffr