Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes.
Wafer bonding is a critical process in semiconductor manufacturing, enabling the integration of diverse materials and the creation of complex microsystems. We are looking for a motivated Master’s student to develop a comprehensive numerical framework to predict bond wave propagation to start as soon as possible. This thesis aims to bridge the gap between traditional analytical models and advanced computational methods, specifically focusing on Finite Element Method (FEM).
Develop and refine a Finite Element model to simulate the dynamics of the wafer bonding process.
Validation: Compare simulation results with existing experimental data to ensure model accuracy and reliability.
Interdisciplinary Collaboration: Work closely with the System Packaging and Simulation of Semiconductor Technologies departments to align simulation parameters with physical process constraints.
Microsystems Engineering, Electrical Engineering, Physics, Materials Science, Nanotechnology, Semiconductor Technology, or related disciplines.
Enrolled student in Chemnitz, Mittweida or the surrounding area.
Programming: Proficiency in Python for analytical modeling and data processing.
Strong English and German reading and comprehension skills.
FEM Software: Experience with COMSOL Multiphysics, ANSYS or a similar software.
Previous exposure to wafer bonding processes or semiconductor manufacturing technology.
Ability to document complex technical results clearly in English or German.
Basic knowledge and demonstrated skills / awareness regarding surrogate models.
An interdisciplinary research environment at the intersection of simulation and high-end semiconductor hardware.
Access to state-of-the-art simulation tools and experimental data.
Dedicated mentorship from experts in both packaging and semiconductor technology.
A collegial, pleasant and motivating working environment.
Once we have received your online application, you will receive an automatic confirmation of receipt. For data protection reasons, we can only consider applications via our career portal - thank you.