ZEISS Semiconductor Manufacturing Technology – Enabling smaller, more powerful and more energy-efficient microchips
Working where tomorrow is created.
Around 80 percent of all microchips worldwide are manufactured using ZEISS technologies. As the heart of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is the technology leader in semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and solutions for process control, ZEISS enables the manufacture of ever smaller, more powerful and more energy-efficient microchips – and is thus playing a decisive role in shaping the age of micro- and nanoelectronics with its innovations.
Your role
1. Coordinate and align international, cross-functional technical teams, bringing together different disciplines (mechanics, electronics, software, operations) around system realization topics
2. Act as the key technical interface between cross-national R&D and Operations teams, translating system concepts into realizable and industrializable solutions
3. Define and maintain the system architecture for realization and industrialization, ensuring scalability towards HVM and future platform integration
4. Derive and manage realization requirements and define SAT/FAT test and qualification plans at system and sub-component level together with R&D, Operations, and Service
5. Define, select and continuously improve methods, frameworks and tools, leveraging industry best practices to strengthen realization and qualification
Your profile
6. A strong background (master's/diploma) in Systems Engineering, Mechanical/Electrical/Mechatronic Engineering or a related technical field, with experience in complex system development and realization
7. Proven experience in system architecture, requirements engineering and translating R&D concepts into industrializable designs
8. Hands-on experience with test and qualification concepts (e.g. SAT/FAT), including planning on system and subcomponent level
9. Ability to guide and align cross-functional teams, influence stakeholders without formal reporting lines and connect different technical disciplines
10. Very good communication skills in English and German (spoken and written) and the ability to work effectively in an international setup
11. Willingness to travel (e.g. to other ZEISS sites, suppliers or partners) to support alignment on architecture, realization and qualification activities
Your ZEISS Recruiting Team:
Oliver Reith