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Senior equipment engineer

Friedrichstadt
European Semiconductor Manufacturing Company
Ingenieur
Inserat online seit: Veröffentlicht vor 20 Std.
Beschreibung

About us European Semiconductor Manufacturing Company (ESMC) is a joint venture between four technology leaders, TSMC, Bosch, Infineon and NXP, to establish a state-of-the-art semiconductor fab in the heart of Europe. ESMC represents our shared commitment to strengthening the European semiconductor ecosystem. Senior Equipment Hook-Up Engineer As a Senior Equipment Hook-Up Engineer, you will be coordinating all hook-up activities from planning, construction, and commissioning of faculty media supplies (gases, chemicals, exhaust air, ultra-pure water, wastewater, electricity) from the base build supply connection to the process equipment at our new state-of-the-art semiconductor fab in Dresden. Your role will ensure system safety, reliability, efficiency, and compliance while driving continuous improvement and innovation. Become part of the facility team to build ESMC's 300mm semiconductor fab. Develop and manage detailed schedules for equipment hookups, coordinating with equipment vendors, construction teams, contract vendor management, and facility engineers to ensure seamless integration in compliance with environmental and safety regulations. Review and approve hookup designs and engineering plans, ensuring compliance with industry standards and project specifications. Experience in electrical, process colling water, ultra-pure water, Gas & Chemical, and other Plastic utility systems. Data-Driven Decision Making: Monitor and report on the progress of hookup activities to senior management, addressing any issues or delays proactively. Project Involvement: Support system design, construction, and commissioning for new facility installations and upgrades. Degree in Electrical, Chemical, Mechanical or Automation Engineering or a related field Must have experience: 10+ years of experience in equipment hookup or facility engineering within the semiconductor industry. Proven track record in managing large-scale construction or installation projects. Familiarity with semiconductor fabrication processes and equipment. Language Skills: Fluent German and English language skills. Proficient with Microsoft Office, discipline-specific software (i.e., AutoCAD, Revit, etc.). Work in a fast paced, international startup environment while at the same time having access to the experience, talent, and resources of the largest and most advanced semiconductor manufacturer in the world, TSMC. Contact Please apply with English resume using the following link:

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