ZEISS has started a major strategic initiative to establish an interdisciplinary team in a dynamic and agile startup environment. The corporate-backed startup will benefit from ZEISS’s ecosystem and its expertise in the field of photonics.You will play a key role in the design and development of advanced photonic packaging solutions that enable the high performance and reliability of our PICs. You will create innovative packaging designs that meet the technical requirements of advanced photonic systems. Your roleDevelop and design packaging solutions for photonic integrated circuits, including aspects of mechanical, thermal, and optical interfaces.Design package structures that optimize optical alignment between the PICs, optical fibers, optical components and external devices such as lasers and detectorsEstablish high-precision alignment and assembly processes, outline test protocols to assess the performance and reliability of the packaging solutions, and interpret test data to drive further improvements.Collaborate closely with photonic designers, engineers, process engineers, and manufacturing teams to enhance packaging solutions.Your ProfileMaster’s degree or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field. Specialized knowledge or coursework in photonics, optoelectronics packaging, or microsystems. 3+ years of industry or academic experience in the design and development of packaging solutions, preferably for photonics, optoelectronics, or semiconductor devices. Experience with packaging techniques such as wire bonding, flip-chip bonding, and fiber-optic alignment is highly desirable. Experience working with high-frequency electrical packaging and RF interconnects is a plus. Proficiency with CAD tools for 3D modeling and simulation (e.g., SolidWorks, AutoCAD, or ANSYS). Experience with thermal and stress simulation tools such as COMSOL or FEA software. Excellent communication and collaboration abilities, with a proactive approach to teamwork in English and GermanAbility to work in a fast-paced, deadline-driven environment.